The FOXPSO prototype board has a double side soldering area of:
- 88 metallized holes step 2.54 mm (100 mils) for through hole
(?) discrete components.
- 540 metallized holes step 1.27 mm (50 mils) for SMD (?) discrete componets.
- 192 metallized pads on either side +holes step 1.27 mm (50 mils) for SOIC integrated circuits (?).
Like the FOXP254 prototyping board, also the FOXPSO has J6/J7 signals replicated inside the
prototyping area.
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FOXP_254
Prototyping board step 1.27mm (50 mils)
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